Semiconductor thermal analysis
Algorithms and simulation workflows for studying temperature distribution, hotspots, heat flow and cooling performance across semiconductor packages and related thermal-management systems.
Thermal analysis algorithms for semiconductors and heat exchangers
Developing computational algorithms for analysing thermal behaviour, identifying performance bottlenecks and supporting better design and optimisation decisions.
About the project
Thermal management is one of the major constraints on the performance, reliability and efficiency of semiconductor systems. As devices become smaller, more powerful and more densely integrated, heat generation becomes increasingly difficult to manage. Localised hotspots, uneven temperature distribution, material interfaces and cooling limitations can directly affect performance and component life.
Reliable thermal-analysis algorithms make it possible to study these effects before physical prototypes are manufactured. By simulating heat generation, conduction, convection and cooling behaviour across different operating conditions, engineers can compare designs, identify bottlenecks and make better decisions about geometry, materials, packaging and thermal-management strategies.
Heat exchangers present a related challenge at a different scale. They are used across energy systems, industrial equipment, electronics cooling, transportation and ground-source thermal systems. Improving exchanger efficiency can reduce energy consumption, improve heat transfer and make the surrounding system more effective. The work therefore covers both compact semiconductor thermal problems and broader heat-transfer systems where analysis and optimisation are closely connected.
How it works
The workflow begins by representing the geometry, material properties, heat sources, interfaces, flow conditions and boundary conditions of the system. For semiconductor applications, this may include chips, packages, substrates, heat sinks, thermal-interface materials and localised power dissipation. For heat exchangers, the model may include fluid passages, solid regions, pipe arrangements, surrounding ground and operating temperatures.
Numerical algorithms are then used to solve the governing heat-transfer equations and estimate temperature fields, heat fluxes, pressure or flow-related behaviour where relevant and overall thermal performance. The results help identify hotspots, inefficient regions, thermal resistance and design features that limit heat removal.
Once the analysis workflow is established, it can also support optimisation. Geometry, materials, channel layouts, operating conditions and cooling configurations can be varied systematically to identify designs that improve heat transfer, reduce peak temperature, or increase overall efficiency.
Geometry and operating conditions → thermal model → field solution → performance assessment → design optimisation
What the work produced
The work created computational foundations for analysing and improving thermal systems across semiconductor devices and heat-exchanger applications.
Heat-exchanger performance modelling
Computational methods for evaluating heat-transfer behaviour in compact, industrial and ground-coupled heat exchangers under different geometric and operating conditions.
Analysis-led optimisation
A framework for moving beyond thermal prediction towards design exploration and optimisation of materials, geometry, cooling layouts and operating parameters.
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